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USC CORONAVIRUS (COVID19) UPDATE

NXP® JCOP®

JCOP (Java Card Open Platform) was first developed by IBM Zurich Research Laboratory but taken on by NXP themselves in July 2007 for support and development as the underlying platform was built on NXP silicon.

JCOP was named from:

  • the Java Card Specification which started from 2.2.2 and is up to 3.0.5 as of December 2020.
  • the Global Platform standard which started from 2.1 and is up to 2.3  as of December 2020.

Java Cards contain a Java Card Virtual Machine that enables the Card Applications (applets) to run in the popular Java programming language.

As there are a proliferation of versions and memory sizes within JCOP / JCOP3 / JCOP4 please refer to the table below we have formulated for further information.

Universal Smart Cards keep sample cards on stock to help with proof-of-concept deployments and pilots.

In addition to white cards, we offer full scale pre-printing services, personalisation, app loading and numbering from our technical centre in Portsmouth.

If you cannot see something you require, please let us find it for you. Please do give us a call to discuss your requirements in more detail. 

NXP® JCOP® Product Guide
    

Product VersionJCOPJCOP
JCOP3JCOP3JCOP4
NXP Product Names(JxAyyy)
(JxDyyy)
(JxEyyy)
(JxHyyy)
(JxRyyy)
Java Card Version2.2.2
3.0.1
3.0.1
3.0.4
3.0.5

Global Platform

2.12.22.22.22.3

Max Memory

128KB
145KB
145KB
144KB
180KB
TypeEEPROM
FlashFlash
Flash
Flash
Extended APDU SupportYYYYY
RSA512 - 2048
512 - 2048
512 - 2048
512 - 2048
512 - 4096
EC128 - 320
128 - 320
112 - 521
-
521
TDES56, 112, 168
56, 112, 168
56, 112, 168
56, 112, 168
56, 112, 168
AES128, 192 & 256
128, 192 & 256
128, 192 & 256
128, 192 & 256
128, 192 & 256
Mac/HashSHA1, SHA224, SHA256, SHA384, SHA512, CRC16, RIPEMD
SHA1, SHA224, SHA256, SHA384, SHA512, CRC16, KorenSEED, MD5, RIPEMD
SHA1, SHA224, SHA256, SHA384, SHA512, CRC16, CRC32, KorenSEED, MD5, RIPEMD
SHA1, SHA224, SHA256, SHA384, SHA512, CRC, KorenSEED
SHA1, SHA224, SHA256, SHA384, SHA512, CRC, KorenSEED
MOCNNNNOptional
Certification HW, SWEAL5+
EAL5+
EAL5+
EAL5+
EAL6+
Packaging

Contact, Contactless, Dual Interface

(Bonded Module)

Contact, Contactless, Dual Interface

(Bonded Module)

Contact, Contactless, Dual Interface

(Bonded Module)

Contact, Contactless, Dual Interface

(Bonded Module)

Contact, Contactless, Dual Interface

(Bonded Module)

Product Information Leaflet 
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For more information, samples, pricing and lead times on any of our NXP JCOP products, please contact our sales team and one of our specialists will be happy to help you.

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